Journal of Engineering Research and Reports (ISSN: 2582-2926) aims to publish high-quality papers in all areas of engineering. The journal also encourages the submission of useful reports of negative results. This is a quality controlled, OPEN peer-reviewed, open access INTERNATIONAL journal.

2021 - Volume 20 [Issue 3]

Augmented Leadframe Design for Stable Multi-Wire Ground Bonding

Frederick Ray I. Gomez, Alyssa Grace S. Gablan, Anthony R. Moreno, Nerie R. Gomez

Page: 1-5
Abstract View: 53 times | Full Article – PDF: 46 times | Review History: 0 times |

Understanding Package Crack Signatures in a Leadframe Semiconductor Package

Jefferson Talledo

Page: 6-14
Abstract View: 60 times | Full Article – PDF: 44 times | Review History: 0 times |

Glue Voids Reduction on QFN Device through Material and Process Improvement

Edwin M. Graycochea Jr., Endalicio D. Manalo, Rennier S. Rodriguez, Frederick Ray I. Gomez

Page: 15-19
Abstract View: 28 times | Full Article – PDF: 28 times | Review History: 0 times |

Mathematical Skills and the Academic Performance of Junior and Senior Electrical Engineering Students of the University of Eastern Philippines

Kenneth Bryan F. Abaigar, Benjamin D. Varela

Page: 20-31
Abstract View: 37 times | Full Article – PDF: 20 times | Review History: 0 times |

Die Crack Resolution through Pick-up Process Optimization for BGA Package

R. Rodriguez, E. Graycochea Jr., F. R. Gomez, E. Manalo

Page: 32-36
Abstract View: 27 times | Full Article – PDF: 24 times | Review History: 0 times |

Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Jefferson Talledo

Page: 37-43
Abstract View: 25 times | Full Article – PDF: 21 times | Review History: 0 times |

View All Issues