Journal of Engineering Research and Reports (ISSN: 2582-2926) aims to publish high-quality papers in all areas of engineering. The journal also encourages the submission of useful reports of negative results. This is a quality controlled, OPEN peer-reviewed, open access INTERNATIONAL journal.
Current Issue
2021 - Volume 20 [Issue 3]
Original Research Article
Augmented Leadframe Design for Stable Multi-Wire Ground Bonding
Page:
1-5
Abstract View: 53 times | Full Article – PDF: 46 times | Review History: 0 times |
Understanding Package Crack Signatures in a Leadframe Semiconductor Package
Page:
6-14
Abstract View: 60 times | Full Article – PDF: 44 times | Review History: 0 times |
Glue Voids Reduction on QFN Device through Material and Process Improvement
Page:
15-19
Abstract View: 28 times | Full Article – PDF: 28 times | Review History: 0 times |
Mathematical Skills and the Academic Performance of Junior and Senior Electrical Engineering Students of the University of Eastern Philippines
Page:
20-31
Abstract View: 37 times | Full Article – PDF: 20 times | Review History: 0 times |
Die Crack Resolution through Pick-up Process Optimization for BGA Package
Page:
32-36
Abstract View: 27 times | Full Article – PDF: 24 times | Review History: 0 times |
Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling
Page:
37-43
Abstract View: 25 times | Full Article – PDF: 21 times | Review History: 0 times |