Implementation of Pads Re-layout for QFN Multi-row Breakthrough
R. Rodriguez *
STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
F. R. Gomez
STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
M. G. Maming
STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
An alternative design of Quad-Flat No-lead (QFN) leadframe capable with three or more arrays of lead is discussed and presented on this paper. The leadframe design is integrated with connecting bars that can be routed and bonded with wires to decrease the wire span and create a more manufacturable wirebonding structure in densified design of QFN. In addition, the connecting bars produced an inter-connection link between relocated pads and extended input/output (I/O) leads for the 3rd array electrical connections. The implementation of the proposed augmented design would improve the manufacturability of multiple arrays of I/O in QFN, enabling cost-saving initiative and manufacturing solution to devices with multiple arrays requirement.
Keywords: Leadframe design, QFN, multi-row, assembly.