A Study of Dispense Needle for Die Attach Voids Mitigation
R. Rodriguez *
New Product Development and Introduction, STMicroelectronics Inc., Calamba City, Laguna, 4027, Philippines.
B. C. Bacquian
New Product Development and Introduction, STMicroelectronics Inc., Calamba City, Laguna, 4027, Philippines.
F. R. Gomez
New Product Development and Introduction, STMicroelectronics Inc., Calamba City, Laguna, 4027, Philippines.
E. Graycochea Jr.
New Product Development and Introduction, STMicroelectronics Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The need of data storage devices and new technologies continues to grow with more robust and stable functioning capability. With that, improvement and utilization never stop for a seamless output. One device that is currently on new product introduction is a quad-flat no-leads (QFN) utilizing a tapeless leadframe technology. The new device used highly conductive glue with metal spacer and has experienced gross glue voids defect parts per million (ppm). Glue voids were measured for cumulative voids criteria, with values higher compared to the specification. The study used analysis of variance (ANOVA) on the dispense needle diameter and revealed the effect levels of needle diameter on cumulative voids reduction. For subsequent works, the configuration could be applied for packages with similar requirement.
Keywords: Die attach process, QFN, dispense needle, glue voids.