Semiconductor Package Design Solution for Addressing High-Density Configuration
Rennier Rodriguez *
STMicroelectronics, Inc., Calamba City, 4027 Laguna, Philippines.
Frederick Ray Gomez
STMicroelectronics, Inc., Calamba City, 4027 Laguna, Philippines.
Maiden Grace Maming
STMicroelectronics, Inc., Calamba City, 4027 Laguna, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed through augmentation of routing channels at the backside of the silicon die to eliminate the substrate application in the package. Routed channels are fabricated using plating or immersion process that are electrically connected to the bonding pads through conductive via within the silicon material. By eliminating the substrate re-distribution layers (RDL), a package is expected to decrease by 20 – 40% from its designed dimension.
Keywords: Substrate, BGA, semiconductor, assembly