Compound Handling Automation: An Error Proof Solution in Eliminating Mold Misprocessing
Ernani D. Padilla *
Process Engineering, STMicroelectronics, Inc. Calamba City, Laguna, 4027, Philippines.
Emmanuel P. Birog
Process Engineering, STMicroelectronics, Inc. Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
This paper aims to identify and eliminate the weaknesses of the epoxy mold compound (EMC) thawing process that contributes to mold misprocessing occurrence such as wrong mold compound, under thawed or expired mold compound.
Creation of automation solutions addressing high risk areas such as barcoding of compound traceability, auto-locking system of thawing cabinet and thawing room access, automated map of compound status and upgrade of lot transaction system to link with EMC status and identity was implemented. Collectively this makes the process error proof from wrong judgement or negligence from human dependent activities.
The project was able to eliminate occurrence of possible mold misprocessing related to EMC thawing and serves as cost avoidance due to potential lots affected.
Keywords: Epoxy mold compound, material handling, automation, thawing.