Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
Rennier S. Rodriguez *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray I. Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Bryan Christian S. Bacquian
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and dents, uneven bonding of die, localized insufficient epoxy, and misaligned die encountered during the conversion and setup stage. The implementation of the augmented design improves the current assembly practice through eliminating the replacement of anvil block that is the cause of misalignment on the indexer handler of the die attach machine. Through this design, the selection of appropriate vacuum hole setup can be through the sliding insert only without pulling out the anvil block from the machine.
Keywords: Anvil block, assembly, die attach process, leadframe, QFN.