Upgrading Die Attach Machine Capability for Micro Electromechanical Systems Package
Michael D. Capili *
STMicroelectronics Inc., Calamba Philippines, LISP II Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The paper discussed the study and challenges of the Die Attach process, the critical characteristics of the product structure and the demand for the MEMS product. Upgrading the current machine mechanical and software to improve the machine's capabilities and overcome the criticality of the product structure, such as; 30 microns Die Placement accuracy, can process Wafer with dual Die Orientation 0 and 180 degrees, capable of detecting incorrect die orientation and finally can process thin substrate with 130 microns thickness. After machine upgrades, statistical validation using Two Proportion tests was used to help validate the machine's performance efficiently. The new upgraded machine has the same capability and performance as the new die attach machine model, therefore the upgrade and enhancement on the old model Die Attach machine are effective and efficient.
Keywords: Die attach, MEMS packages, wafer orientation.