Flux Shorting Mitigation on Semiconductor BGA Device through Process Design Enhancement
Antonio R. Sumagpang Jr. *
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Edwin M. Graycochea Jr.
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray I. Gomez
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
With the new and upcoming technologies in semiconductor industry, packages like the ball grid array (BGA) are getting more challenging to process due to inherent issues that come along. Process improvement through modification in the design of indirect material is one key direction to improve the productivity during assembly manufacturing. In this paper, an enhanced design of dipping plate is presented to solve the issue of flux shorting due to out-of-specs dipping plate at ball attach process. The study used a side by side comparison to prove that the new design is better than that of the out-of-specs indirect material. With the new enhanced design of dipping plate and the optimized flux depth parameter, flux shorting occurrence was successfully mitigated.
Keywords: BGA, flux shorting, semiconductor package, solder ball.