Elimination of Crumpled Leadframe Defect through Machine Sensor Enhancement
Jonathan C. Pulido *
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027 Philippines.
Edwin M. Graycochea Jr.
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027 Philippines.
Frederick Ray I. Gomez
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027 Philippines.
*Author to whom correspondence should be addressed.
Abstract
The paper focused on the improvement done in quad-flat no-leads (QFN) leadframe package assembly to address the quantity of rejection of crumpled leadframe during handling at wirebond process station. Overload sensor at the output magazine handler was found out to be defective, hence a new sensor was installed. With the improvement done, crumpled leadframe strip occurrence was ultimately eliminated.
Keywords: Assembly, crumpled leadframe, QFN, wirebonding.