Wirebond Process Optimization through Stitch Relocation on QFN Package
A. Moreno *
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
E. Graycochea Jr.
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
F. R. Gomez
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
*Author to whom correspondence should be addressed.
Abstract
One of the most challenging assembly manufacturing process in semiconductor industry is wirebond process using a wire as direct material. With this new technology, some issues were encountered during the first trial of a quad flat no-leads (QFN) package. This paper is focused on the heal crack seen on the stitch formation during second bond. A comprehensive improvement was done by relocating the stitch formation on the second bond. Ultimately, heal crack occurrence was successfully eliminated.
Keywords: Heal crack, leadframe, QFN, stitch formation, wirebonding.