Ensuring Accurate Results in Fracture Mechanics Four-Point Bending Interface Characterization
Jefferson Talledo *
STMicroelectronics, Inc., Calamba City, 4027, Laguna, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Interface adhesion tests are conducted to obtain a quantitative value of the adhesion strength or interface fracture toughness to forecast initiation and propagation of interface delamination failures in semiconductor packages. One of the common methods of fracture mechanics interface characterization is the four-point bending test. Problems with the experimental setup would result in having inaccurate results. In this study, different issues with the four-point bending test using mold/copper bi-material beam with notch were addressed. It was shown that incorrect anvil alignment and centering could give inaccurate fracture toughness results. The distance between anvil supports and the depth of the notch is also very important. From the study, it can be concluded that issues with experimental setup and the test sample must be addressed to ensure accurate results from four-point bending interface characterization.
Keywords: Fracture mechanics, four-point bending, interface fracture toughness, mold/leadframe adhesion.