Augmented Leadframe Design for Stable Multi-Wire Ground Bonding
Frederick Ray I. Gomez *
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
Alyssa Grace S. Gablan
Operations 1 Assembly Manufacturing, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
Anthony R. Moreno
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
Nerie R. Gomez
Operations 1 Assembly Manufacturing, STMicroelectronics, Inc., Calamba City, Laguna, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design solution of quad-flat no leads (QFN) to mitigate the leadframe bouncing and its consequent effect of lifted wire and/or non-stick on leads (NSOL) defects on multi-wire ground connection. Multi-wire on single lead ground (or simply Gnd) connection plays critical attribute in the test coverage risk assessment. Cases of missing wire and/or NSOL on the multi-wire Gnd connection cannot be detected at test resulting to Bin1 (good) instead of Bin5 (open) failure. To ease the failure modes mechanism, a new design of QFN leadframe package with lead-to-diepad bridge-type connection was conceptualized for device with extended leads and with multiple Gnd wires connection. The augmented design would provide better stability than the existing leadframe configurations during wirebonding. Ultimately, the design would help eliminate potential escapees at test of lifted Gnd wire not detected.
Keywords: Bridge-type connection, extended leads, ground signal, leadframe bouncing.