Glue Voids Reduction on QFN Device through Material and Process Improvement
Edwin M. Graycochea Jr. *
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
Endalicio D. Manalo
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
Rennier S. Rodriguez
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
Frederick Ray I. Gomez
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sintering glue which is a main contributor on the voids occurrence. Eventually, the glue voids were reduced to less than the allowed 5% limit. For future works, the learnings and configuration could be used on devices with similar requirement.
Keywords: Die attach process, glue voids, QFN, stencil printing.