Automotive Package Lead Pullback Elimination Using Monte Carlo Analysis for Determining Leadframe and Blade Design
Jefferson S. Talledo
New Product Development & Introduction, Philippines.
Patricio A. Cabading Jr. *
Process Engineering, ST Microelectronics, Inc. Calamba City, Laguna, 4027, Philippines.
Rogelio A. Real
New Product Development & Introduction, Philippines.
*Author to whom correspondence should be addressed.
Abstract
This study focuses on eliminating the lead pullback problem in an automotive quad flat no lead (QFN) package in order to meet the non-negotiable requirement to have a solder wettable or solderable lead sidewall. It involves using a non-traditional approach of Monte Carlo tolerance analysis to determine the final leadframe and singulation blade design solution. It was found out that the zero lead pullback could be achieved by reducing the leadframe lead to lead distance from 0.275 mm to 0.225 mm and increasing the blade thickness from 0.325 mm to 0.350 mm. Actual results from 10 line stressing lots all showed zero pullback validating the effectiveness of the final design and the use of Monte Carlo tolerance analysis technique. Costly investment for a lead pullback inspection system was avoided and the 100% manual inspection eliminated.
Keywords: Pullback, singulation process, leadframe, singulation blade, Monte Carlo analysis, tolerance analysis, solder wettable, solderable lead sidewall