Die Placement Performance Evaluation on Different Machine Platforms
Rennier Rodriguez
New Product Development and Introduction, STMicroelectronics, Inc. Calamba City, Laguna, 4027, Philippines.
Edwin Graycochea Jr.
New Product Development and Introduction, STMicroelectronics, Inc. Calamba City, Laguna, 4027, Philippines.
Frederick Ray Gomez *
New Product Development and Introduction, STMicroelectronics, Inc. Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best performance in terms of die placement tolerance capability. Die placement tolerance were quantified and only die attach Machine B was able to satisfy the specification of less than 30 microns. The study used a bar graph comparison in terms of die placement tolerance on the two machines and presented the effect of machine selection on die placement tolerance capability. For future works, the selected die attach machine could be used for devices with critical requirement.
Keywords: Die attach process, die placement, LGA, substrate package