Silicon Die with Integrated Epoxy for Improved Interface Adhesion
F. R. Gomez
New Product Development & Introduction, Back-End Manufacturing and Technology STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
R. Rodriguez *
New Product Development & Introduction, Back-End Manufacturing and Technology STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adhesion between the die and the die attach material during the die attach process. The wafer preparation flow is also presented. The realization of the augmented die design with integrated epoxy material would ultimately provide a robust connection and would mitigate the die attach related issues such delamination, die cracks and voids.
Keywords: Adhesion, delamination, die attach process, glue, epoxy, silicon die