Off-centered Ball Resolution Through Multi-hole Process Plate Implementation at Wirebond Process
J. Pulido *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
F. R. Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
E. Graycochea Jr.
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to off-centered ball (OCB) reject during the formation of wire on a quad flat no-leads (QFN) device. The panel type single-row process plate cannot totally vacuum the warped leadframe and this is resulting to off-centered ball. Through changing the panel type single-row process plate to panel type multi-hole process will have a strong vacuum sucked underneath the leadframe and eliminates the occurrence of off-centered ball. Future works could use the improved process plate design for devices of similar configuration.
Keywords: Assembly, bond ball, process plate, wirebond