Elimination of Intermetallic Coverage Over-etching on Aluminum Pad
Jonalyn Jaylo-Sia
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
Jonathan Pulido *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
Frederick Ray Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna-4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability stresses. The challenging approach in IMC analysis detect as over-etching around IMC area that leads to inaccurate IMC data collection. To address the over-etching, we generate a new method which is backside polishing that results to a reliable IMC data collection and help reduced the cycle time of IMC data gathering.
Keywords: Acid dripping, backside polishing, intermetallic coverage, over-etching