Wire Shorting Elimination through Wirebond Process Optimization of Semiconductor Sensor Device
Anthony Moreno *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Edwin Graycochea Jr.
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
New and upcoming semiconductor devices and technologies are getting more challenging in assembly manufacturing process due to many factors such as complex package layout, process capability and critical bill of materials. This paper focused on the mitigation of the top major assembly reject of a semiconductor sensor device, that is the wire-to-wire shorting issue at wirebonding process. Parameter optimization particularly the looping segment 1 parameter, as well as using a reverse stitch on ball (RSOB) were employed to eliminate the wire-to-wire defect in wirebonding process. Finally, with the process optimization and improvement, a reduction of 98 percent wire-to-wire shorting occurrence was attained.
Keywords: Wirebonding, wire-to-wire short, process improvement, semiconductor, assembly