Journal of Engineering Research and Reports

Thinner and smaller packages require thinner vertical structure of the integrated circuit (IC) design with the wafer playing essential role in package thinning. As the wafer goes thinner, problems may occur in the pre-assembly or wafer preparation. With the introduction of new pre-assembly technology such as laser die attach film (DAF) cut and dicing before grinding, technical challenges were expected. The paper focused on eliminating the edge cutting issue by considering the appropriate taping lamination technique. Tensionless lamination helped eliminate the horizontal pressure applied into the tape thus mitigating the edge cutting problem.  For future works, the configuration shared in this paper could be applied on wafers with comparable technology.